Company and Job Overview
A leading semiconductor fabrication is looking for a Staff Engineer to be responsible for Plasma Dicing Process Development
Responsibilities
Lead and execute plasma process development initiatives to enhance fabrication capabilities.
Conduct root cause analysis and implement effective problem-solving strategies for process and equipment issues.
Drive process and machine improvements, including the implementation of plasma dicing machines and associated processes.
Collaborate with customers on engineering builds, design of experiments (DOE), data analysis, and prepare technical reports and presentations.
Perform failure analysis, investigate root causes, and prepare FACA reports for management review.
Coordinate with third-party vendors to identify solutions that improve process capabilities and quality.
Manage customer engineering builds and qualification activities, working closely with factory teams to optimize resource utilization.
Monitor the progress of key deliverables, ensuring alignment with project milestones and success criteria through regular communication with customers.
Establish, track, and refine KPIs for the plasma dicing development team to support new product development, process qualification, and robust manufacturing practices.
Qualifications & Experience:
Bachelor’s or higher degree in Materials Science, Applied Physics, Mechanical Engineering, or a related field.
Minimum of 5 years of experience as a Plasma Dicing Process or Development Engineer, preferably within the semiconductor industry.
Prior experience with OSAT or similar outsourced semiconductor assembly and test facilities is a plus.
Hands-on experience with plasma dicing technologies and processes, including Bosch Process silicon etching.
Proficiency with JMP data analysis software and capability for data-driven process optimization.
Catherine Qu
JAC Recruitment Pte Ltd
EA Personnel: R22104823
EA Personnel Name: QU QIUSHI
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