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Director, Application Engineering

Job title: Director, Application Engineering
Specialisation: Semiconductors
Salary: SGD 150,000 - 200,000 (Annual)
Reference: PR/096123
Job published: October 16, 2025 11:12
Work Arrangement: Onsite

Company and Job Overview

As the Director of Application Engineering, you will lead global technical engagements with OEMs in the high-performance electronics sector. You’ll manage a team providing expert consultation on PCB stack-up design, materials selection, signal integrity, thermal performance, and qualification test plans. Your role is crucial in converting complex customer needs into manufacturable, high-performance solutions aligned with company strategies and product capabilities.

Responsibilities

Customer-Focused Support 

Lead global OEM engagements for PCB stack-up design, material selection, and performance simulation.

Serve as a technical liaison during design-in cycles and new product adoption phases.

Oversee design guidelines, test protocols, and material documentation.

Strategic & Technical Leadership 

Develop and implement a global application engineering strategy to support growth, product differentiation, and customer satisfaction.

Collaborate with Product Management, Sales, R&D, and Operations on stack-up capabilities, signal integrity, and thermal reliability.

Team Management 

Lead and develop a global team of application engineers and technical field resources.

Create scalable processes for modeling, test plan development, and failure analysis.

Technology & Standards Leadership 

Maintain expertise in advanced materials like high-speed, low-loss laminates, and thermally conducive prepregs.

Represent the company in standards bodies and customer forums.

Collaboration and Influence 

Partner with OEMs to co-develop validation plans and facilitate new design engagement.

Ensure technical alignment across global sites for consistent application engineering services.Top of Form

 

Qualifications

15+ years in Application Design within industries like advanced materials, semiconductors, electronics, automotive, or aerospace.

Experience with global laminate or PCB manufacturing.

Familiarity with IPC/JEDEC protocols and failure analysis methodologies.

Bachelor’s in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. A Master’s (M.S. or M.Eng) or MBA with a strong technical background is preferred.

Certifications in signal integrity, thermal management, or high-speed digital design are advantageous.

Fluent in English for business and technical communication.

Proficiency in Mandarin Chinese is strongly preferred for collaboration with OEMs and technical teams in China and Taiwan.

Additional language skills are a plus.

 

Catherine Qu 
JAC Recruitment Pte Ltd 
EA Personnel: R22104823 
EA Personnel Name: QU QIUSHI

 

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